Heilind Electronics, Inc. in Wilmington, MA, US (United States)

www.heilind.com

Company Overview:

Heilind is your interconnect specialist. We are dedicated to exceeding the levels of customer satisfaction by continually striving for the highest standards in quality, service and products. We are committed to our customers and recognized as the model of excellence by our suppliers.
Component Modification and Assembly Services Heilind has a six valued added centers located around the country to support your value-add needs in Tyco/AMP, Molex, 3M, Samtec, Tyco/Raychem, FCI and Panduit, performing the following services:
Assembly, Kitting, Part Modification, Special Labeling and Packaging , Circular connectors, D-subs, Fans, Rack and Panel , Terminal Blocks, Switches & relays, Components, D-subs, IDC, Parts dying (color coding) , Custom marking, Custom labeling, Cut tubing, Break-a-way headers, Latch headers, Pin Extraction
Heilind supports a wide-range of custom packaging, bar coding, labeling and quality inspections.


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Contact Details

Address:58 Jonspin Road, Wilmington, MA, 01887, United States
Telephone:(800) 800-1666
Fax:(978) 658-0278
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The SliderZ connector, with its .050" (1.27mm) pitch and "slide" mating action, allows the user to mate or remove one pcb in the Z-axis while leaving the other pcb(s) undisturbed. 

With Heilind’s extensive Tyco Electronics inventory, you are sure to find connectors, relays, switches, circuit breakers or any other item you are likely to need for your applications. 

ETTERS, Pa. (June 28, 2005) – FCI, a leading developer of connectors and interconnect systems, has developed ExpressCard™ host connectors and slot systems to support implementation of ExpressCard technology in mobile and desktop PCs. 

LISLE, Ill. – July 23, 2004 – Molex Incorporated (NASDAQ: MOLX and MOLXA) announced today that its GbX™ Reference Backplane Demonstrator has reached new heights in helping chip and system designers predict a component’s full performance ability in an actual datacom or telecom system. 

LISLE, Ill. – June 5, 2006 – As computer components evolve to require increased speeds and bandwidths, the electronics industry is creating new specifications to fully enable next-generation communications platforms. 

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